We are perfectly prepared ourselves to serve our customer's needs through not only supplying new material and equipment but also introducing high technology.

bullet Material & Equipment for BGA, Flip Chip, HDI High layer PCB
       NELCO Material (Thin core, Prepreg)
       ALMEX / NI-AU PLATING EQUIPMENT
       ASAHI KASEI / HIGH RESOLUTION DRY  FILM RESIST
       TCM / FINE PATTERN ETCHING M/C(D-E-S)
       OHT / Testing Equipment
       Anvik / LPI Exposure Machine
bullet Material for Build-Up & IVH Board
       Asahi Glass / Aflex Film
       Nelco / Laser Drillable Prepreg
bullet Material for CCL
       Mitsui Mining & Smelting : Copper Foil
       Asahi-Schwebel : Glass Cloth
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