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bullet BGA, Flip Chip, HDI High layer PCB 용 자재 및 장비
     ¢Ñ  NELCO 자재 (Thin core, Prepreg)
     ¢Ñ  ALMEX / NI-AU PLATING EQUIPMENT
     ¢Ñ  ASAHI KASEI / HIGH RESOLUTION DRY  FILM RESIST
     ¢Ñ  TCM / FINE PATTERN ETCHING M/C(D-E-S)
     ¢Ñ  OHT / Testing Equipment
     ¢Ñ  Anvik / LPI Exposure Machine
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¡¡      ¢Ñ  Asahi Glass / Aflex Film
¡¡      ¢Ñ  Nelco / Laser Drillable Prepreg
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¡¡      ¢Ñ  Mitsui Mining & Smelting : Copper Foil
¡¡      ¢Ñ  Asahi-Schwebel : Glass Cloth
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